| Citation: | Huikun Wang, Jia Sun, Jian Zhang, Mingfei Wang, Bo Peng, Guangxu Dong, Tingju Li, Jinchuan Jie. Effects of mechanical vibration on the solidification microstructure and properties of Cu-xSn alloys[J]. Materials Lab. doi: 10.54227/mlab.20250103 |
This study prepared Cu-xSn (wt.%) alloys using intermediate-frequency induction heating coupled with a mechanical vibration (MV) field, followed by comprehensive microstructural characterization and property evaluations. Characterization techniques such as X-ray diffractometer (XRD), scanning electron microscope (SEM), and electron probe microanalyzer (EPMA) were employed to analyze the phase composition and distribution of the Cu-xSn alloys. The experimental results show that the macroscopic solidification structure of the Cu-xSn alloys transforms from coarse columnar grains to fine equiaxed grains after applying the vibration field. The MV enhances the solid solubility of Sn in the matrix and significantly refining grain size. Moreover, it optimizes the distribution and morphology of secondary phases while effectively suppressing micro-segregation. Performance tests show that increasing Sn content and applying mechanical vibration improve the hardness and tensile strength of the alloys, while the electrical conductivity is deteriorated. This research provides important guidance for the composition design and fabrication of Cu-Sn alloys with uniformly refined microstructures.
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Schematic diagram of the casting devices under MV
a XRD results of Cu-xSn alloy under different conditions, b partial enlarged images of the red dotted frame in a, c macroscopic structure of Cu-xSn alloy under different conditions
The microstructure of Cu-xSn alloys under different conditions: SEM of a Cu-10Sn without MV, b Cu-10Sn under MV, c Cu-5Sn without MV, d Cu-5Sn under MV, and corresponding EPMA of e Cu-5Sn without MV, f Cu-5Sn under MV.
a Hardness variation and b electrical conductivity of Cu-xSn alloys under different conditions
Tensile properties of Cu-xSn alloys under different conditions and corresponding tensile fracture microstructure, a stress-strain curves, tensile fracture microstructure of b Cu-5Sn, c MV Cu-5Sn, d Cu-10Sn and e MV Cu-10Sn
The cooling curves of Cu–5Sn alloy a without and b with MV, schematic diagram of grain formation and growth c without and d with MV