| Citation: |
Yongjian Zhang, Hailong Zhang. Interface engineering toward high thermal conductivity in diamond composites[J]. Materials Lab, 2023, 2(3): 230004. doi: 10.54227/mlab.20230004
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Interface engineering toward high thermal conductivity in diamond composites
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Abstract
Diamond particle reinforced metal matrix (metal/diamond) composites with high thermal conductivity and tailorable coefficient of thermal expansion are an ideal thermal management material for electronic packaging applications. Interface engineering is the key to designing metal/diamond composites due to large difference between metal and diamond in both chemical and physical nature. In this paper, we briefly summarize recent progress in the interface engineering of metal/diamond composites and give some perspectives on future development in this field.
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Author Biographies
Yongjian Zhang is a postdoctoral fellow at State Key Laboratory for Advanced Metals and Materials of University of Science and Technology Beijing. He received his Ph.D. degree from University of Science and Technology Beijing in 2023. His scientific interest is focused on metal matrix composite with high thermal conductivity, interface engineering, and thermal conduction of metal/nonmetal interface. 
Hailong Zhang is a professor at State Key Laboratory for Advanced Metals and Materials of University of Science and Technology Beijing. He received his Ph.D. degree from Xi’an Jiaotong University in 2003. His scientific interest is focused on metal matrix composites and thermal management materials. -
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Yongjian Zhang, Hailong Zhang. Interface engineering toward high thermal conductivity in diamond composites[J]. Materials Lab, 2023, 2(3): 230004. doi: 10.54227/mlab.20230004
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Figure 1.
a Thermal conductivity and coefficient of thermal expansion of thermal management material; b Thermal conductivity of metal/diamond composites with diamond content;[4-18,25,30-33] c Modification strategy of metal/diamond interface.[15] Copyright 2023, Elsevier; d Vibrational density of states of Cu, W2C, and diamond.[27] Copyright 2022, American Chemical Society; e Morphological evolution mechanism of interfacial carbide in Cu/diamond composite modified by metal matrix alloying or in unmodified Al/diamond composite.[15] Copyright 2023, Elsevier.
