| Citation: |
Bowen Cai, Shiyuan Zhao, Fengming Liu. Micro TEC manufacture: the importance and challenges[J]. Materials Lab, 2023, 2(3): 230011. doi: 10.54227/mlab.20230011
|
Micro TEC manufacture: the importance and challenges
-
Abstract
Thermoelectric (TE) technology manifests great potential in solid-state cooling and power generation, especially using micro thermoelectric cooler (Micro TEC) for precise temperature control confined to small systems. It has significant advantages, unique for needs that cannot be met by any other method. However, manufacturing Micro TEC has challenges, and not just those related to TE materials. This paper targets the issues and describes the key points in Micro TEC manufacture from the industrialization point of view, presenting the fabrication difficulties of Micro TEC and emphasizing the importance of industry-university-research cooperation, which is expected to provide helpful insights and inspiration for the development of the domestic TE industry.
-
-
Author Biographies
Bowen Cai is the CTO of Jianju Technology Co., LTD. He held a B.E. from Xi’an University of Technology, a Ph.D. from Yanshan University in Qinhuangdao, China. After that, he joined the School of Materials Science and Engineering in Tsinghua University as a post-doctor fellow. His current research interests include thermoelectric materials and (micro) devices, and high-pressure technology. 
Shiyuan Zhao is the thermoelectric material R&D engineer of Jianju Technology Co., LTD. He received a M.E. from the College of Materials in Shenzhen University in 2020. He is currently engaged in the development of high-performance bismuth telluride-based thermoelectric materials. -
References
1. Y. Qin, B. Qin, D. Wang, C. Chang and L.-D. Zhao, Energy Environ. Sci., 2022, 15, 4527 2. Z. Li, X. Yang, Q. Wang, H. Zhang, Z. Ding, Q. Cao, X. Qian, J. Wang and S. Wang, Materials Lab, 2022, 1, 220026 3. Z. Han, J.-W. Li, F. Jiang, J. Xia, B.-P. Zhang, J.-F. Li and W. Liu, J. Materiomics, 2022, 8, 427 4. C. Tong, Springer Series in Materials Science, 2022, 327, 173 5. B. Sikarwar, R. Phanden and A. Shukla, International Symposium on Fluids and Thermal Engineering (FLUTE 2021), https://www.researchgate.net/publication/363502357_Thermal_Management_of_Electronic_Devices_and_Components/citations, September 2022. 6. J. Yi, N. Chen and L. Zhou, https://www.baogaoting.com/info/8398, August 2020. 7. B. Cai, H.-L. Zhuang, Q. Cao, H. Hu, J. Dong, Asfandiyar and J.-F. Li, ACS Appl. Mater. Inter., 2020, 12, 16426 8. S. Liu, G. Li, M. Lan, T. Baba, T. Baba, T. Mori and Q. Wang, Small, 2021, 17, 2100554 9. Q. Zhang, K. Deng, L. Wilkens, H. Reith and K. Nielsch, Nat. Electron., 2022, 5, 333 10. B. Cai, H. Hu, H.-L. Zhuang and J.-F. Li, J. Alloys Compd., 2019, 806, 471 11. G. J. Snyder, S. LeBlanc, D. Crane, H. Pangborn, C. E. Forest, A. Rattner, L. Borgsmiller and S. Priya, Joule, 2021, 5, 748 12. L. Yang, Z.-G. Chen, M. S. Dargusch and J. Zou, Adv. Energy Mater., 2017, 8, 1701797 13. H. Hu, H.-L. Zhuang, Y. Jiang, J. Shi, J. W. Li, B. Cai, Z. Han, J. Pei, B. Su, Z. H. Ge, B.-P. Zhang and J.-F. Li, Adv. Mater., 2021, 33, 2103633 14. Y. Jiang, J. Dong, H.-L. Zhuang, J. Yu, S. Bin, H. Li, J. Pei, F.-H. Sun, M. Zhou, H. Hu, J.-W. Li, Z. Han, B.-P. Zhang, T. Mori and J.-F. Li, Nat. Commun., 2022, 13, 6087 15. B. Cai, J. Li, H. Sun, L. Zhang, B. Xu, W. Hu, D. Yu, J. He, Z. Zhao, Z. Liu and Y. Tian, Sci. China Mater., 2018, 61, 1218 16. R. Zhang, J. Pei, Z.-J. Han, Y. Wu, Z. Zhao and B.-P. Zhang, J. Adv. Ceram., 2020, 9, 535 17. T.-R. Wei, M. Guan, J. Yu, T. Zhu, L. Chen and X. Shi, Joule, 2018, 2, 2183 18. J. Pei, B. Cai, H.-L. Zhuang and J.-F. Li, Natl. Sci. Rev., 2020, 7, 1856 19. J. Yang, G. Li, H. Zhu, N. Chen, T. Lu, J. Gao, L. Guo, J. Xiang, P. Sun, Y. Yao, R. Yang and H. Zhao, Joule, 2021, 6, 193 20. L. Yin, C. Chen, F. Zhang, X. Li, F. Bai, Z. Zhang, X. Wang, J. Mao, F. Cao, X. Chen, J. Sui, X. Liu and Q. Zhang, Acta Mater., 2020, 198, 25 21. C.-G. Han, X. Qian, Q. Li, B. Deng, Y. Zhu, Z. Han, W. Zhang, W. Wang, S.-P. Feng, G. Chen and W. Liu, Science, 2020, 368, 1091 22. S. Roychowdhury, T. Ghosh, R. Arora, M. Samanta, L. Xie, N. K. Singh, A. Soni, J. He, U. V. Waghmare and K. Biswas, Science, 2021, 371, 722 23. X. Li, P.-F. Liu, E. Zhao, Z. Zhang, T. Guidi, M. D. Le, M. Avdeev, K. Ikeda, T. Otomo, M. Kofu, K. Nakajima, J. Chen, L. He, Y. Ren, X.-L. Wang, B.-T. Wang, Z. Ren, H. Zhao and F. Wang, Nat. Commun., 2020, 11, 942 24. B. Qin, D. Wang, X. Liu, Y. Qin, J.-F. Dong, J. Luo, J.-W. Li, W. Liu, G. Tan, X. Tang, J.-F. Li, J. He and L.-D. Zhao, Science, 2021, 373, 556 25. B. Qin and L.-D. Zhao, Science, 2022, 378, 832 26. F. Shi, J. Zou, Z. Wu, H. Xie and Y. Wang, Mater. Rep., 2021, 35, 19049 -
Rights and permissions
This is an open access article under the terms of the Creative Commons Attribution License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.
Figures(2)
Information
Article Metrics
Export File
Citation
Bowen Cai, Shiyuan Zhao, Fengming Liu. Micro TEC manufacture: the importance and challenges[J]. Materials Lab, 2023, 2(3): 230011. doi: 10.54227/mlab.20230011
Format
Content
DownLoad:
-
Figure 1.
a Schematic diagram of Micro TEC with the structure of the related interface. b Comparison of the maximum cooling temperature difference (ΔTmax) with device size in domestic and foreign Micro TEC. c Compactness developing trend in Micro TEC - the TE legs and/or the leg distance become smaller and smaller.
