Heng Wang, Zhenyu Pan. Performance optimization of thermoelectric devices and its dependence on materials properties[J]. Materials Lab, 2023, 2(1): 220053. doi: 10.54227/mlab.20220053
Citation: Heng Wang, Zhenyu Pan. Performance optimization of thermoelectric devices and its dependence on materials properties[J]. Materials Lab, 2023, 2(1): 220053. doi: 10.54227/mlab.20220053

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Performance optimization of thermoelectric devices and its dependence on materials properties

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  • Corresponding author: heng.wang@iit.edu
  • In this perspective, we discuss the optimized performance of thermoelectric cooling devices and how it is affected by materials properties. The discussion is based on simulations using a numerical method with one dimensional transport equations and the concept of relative current density. The coefficient of performance (COP), representing the efficiency of a device, is of key importance such that when designing a new type of device, it is the parameter to be maximized, whereas others such as the cooling power, can be set by adjusting the dimensions of the design. The COP of a single stage device under a given temperature difference, is only determined by the materials’ figure of merit zT (or z) and the Seebeck coefficient α. While it is the higher the better for the former, the influence of α is complicated. While higher zTs are always preferred, materials with comparably high zT and very different α could be valuable in constructing graded legs that outperform uniform ones. Lastly, proper pairing of legs is important to ensure the materials properties are used to their full potential.


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  • Heng Wang is an assistant professor at department of Mechanical, Materials and Aerospace Engineering, Illinois Institute of Technology. He received his PhD in materials science from California Institute of Technology. Before joining IIT he was a postdoctoral researcher at the Molecular Foundry, Lawrence Berkeley National Lab. His current research interests include high-performance thermoelectric materials, as well as rational device design and applications. In addition, he is particularly interested in the interplay of photoelectric and thermoelectric phenomena.
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